Every package, perfectly bonded.
The autonomous operations layer for semiconductor advanced packaging and OSAT — autonomous die-attach, flip-chip, and hybrid-bonding alignment control, AI warpage, void, bump, and die-crack inspection, HBM and chiplet die-stacking and TSV/underfill optimization, robotic die and substrate handling, yield and known-good-die intelligence, and a package-and-line digital twin that hits target warpage, voids, and yield before the run.
Co-founder & CEO
Advanced-packaging yield engineer who spent a decade ramping flip-chip and 2.5D lines and watched warpage and voids scrap known-good die.
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Co-founder & CTO
Machine-vision and controls engineer who built the bonding-alignment and X-ray defect models Chipira runs on.
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